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| Photo | Mfr. Part # | Stock | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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510-41-064-10-051001SKT PGA SOLDRTL |
2274 | 23.22 |
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Datasheet |
Bulk | 510 | Active | PGA | 64 (10 x 10) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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77-PGM10015-11CONN SOCKET PGA GOLD |
3782 | 23.24 |
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Datasheet |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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614-83-179-15-041112CONN SOCKET PGA 179POS GOLD |
2086 | 21.93 |
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Datasheet |
Bulk | 614 | Active | PGA | 179 (15 x 15) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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24-C212-31CONN IC DIP SOCKET 24POS GOLD |
3086 | 23.28 |
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Datasheet |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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|
24-C300-21CONN IC DIP SOCKET 24POS GOLD |
3171 | 23.28 |
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Datasheet |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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24-C300-31CONN IC DIP SOCKET 24POS GOLD |
2597 | 23.28 |
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Datasheet |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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122-11-952-41-001000CONN IC SKT DBL |
3471 | 23.29 |
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Datasheet |
Tube | 122 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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|
514-87-255M16-001148CONN SOCKET BGA 255POS GOLD |
3563 | 21.84 |
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Datasheet |
Bulk | 514 | Active | BGA | 255 (16 x 16) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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517-83-391-18-101111CONN SOCKET PGA 391POS GOLD |
3402 | 21.98 |
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Datasheet |
Bulk | 517 | Active | PGA | 391 (18 x 18) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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510-93-044-08-031001SKT PGA SOLDRTL |
2322 | 23.29 |
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Datasheet |
Bulk | 510 | Active | PGA | 44 (8 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-93-044-08-031002SKT PGA SOLDRTL |
3402 | 23.29 |
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Datasheet |
Bulk | 510 | Active | PGA | 44 (8 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-93-044-08-031003SKT PGA SOLDRTL |
2046 | 23.29 |
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Datasheet |
Bulk | 510 | Active | PGA | 44 (8 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
110-43-322-61-801000CONN IC SKT DBL |
2022 | 23.29 |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-93-322-61-801000CONN IC SKT DBL |
3973 | 23.29 |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
510-41-065-10-051001SKT PGA SOLDRTL |
3799 | 23.30 |
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Datasheet |
Bulk | 510 | Active | PGA | 65 (10 x 10) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-056-09-041001SKT PGA SOLDRTL |
3076 | 23.30 |
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Datasheet |
Bulk | 510 | Active | PGA | 56 (9 x 9) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
116-93-328-61-003000CONN IC SKT DBL |
3984 | 23.31 |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-93-428-61-003000CONN IC SKT DBL |
2692 | 23.31 |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-93-628-61-003000CONN IC SKT DBL |
3507 | 23.31 |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
84-PGM13042-50CONN SOCKET PGA GOLD |
3461 | 23.32 |
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Datasheet |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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